Ericsson and STMicroelectronics create chipset joint venture
In a further sign of consolidation in the wireless semiconductor industry Ericsson and STMicroelectronics have agreed to merge Ericsson Mobile Platforms and ST-NXP Wireless divisions respectively to create a 50/50 joint venture. The new venture should be in a better position to compete with Qualcomm and Texas Instruments and may help drive lower chip costs.
